Urja Daily
No Result
View All Result
  • News
  • Renewable
    • Solar
    • Rooftop
    • Floating Solar
    • Module
    • Wind
    • Hydrogen
    • Biomass
    • Tenders
    • Sustainibility
  • Storage
  • E-Mobility
  • Battery
  • Smart City
  • Power
    • Smart Grid
    • Microgrid
    • Off-Grid
  • Editor’s Pick
    • Articles
    • In Talks
    • E-MAG
    • Market Research
  • On-demand Webinars
  • More
    • Events
    • Contact Us
    • Subscribe
  • News
  • Renewable
    • Solar
    • Rooftop
    • Floating Solar
    • Module
    • Wind
    • Hydrogen
    • Biomass
    • Tenders
    • Sustainibility
  • Storage
  • E-Mobility
  • Battery
  • Smart City
  • Power
    • Smart Grid
    • Microgrid
    • Off-Grid
  • Editor’s Pick
    • Articles
    • In Talks
    • E-MAG
    • Market Research
  • On-demand Webinars
  • More
    • Events
    • Contact Us
    • Subscribe
No Result
View All Result
Urja Daily
No Result
View All Result
Home News

STMicroelectronics and NUS launch Corporate Labto power the future of Edge AI in Singapore

HELIX joint R&D initiative to enable new generative and embodied AI use cases at the edge through system-to-silicon innovation Research will focus on memory-centric architectures, innovative in-memory computing, scalable compute-and-memory systems, and advanced silicon and embedded-memory technologies Corporate Lab will strengthen Singapore’s advanced semiconductor research capabilities and support the development of future edge AI talent and innovation

Palak by Palak
August 25, 2026
in News
Reading Time: 4 mins read
0
STMicroelectronics
Share on FacebookShare on TwitterShare on Linkedin

STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and the National University of Singapore (NUS) have officially launched the ST–NUS HELIX Corporate Lab, a four-year strategic research initiative focused on advancing the next generation of edge AI technologies. HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation.

The Corporate Lab is supported under the Research, Innovation and Enterprise 2025 plan (RIE2025) and is hosted at the College of Design and Engineering and with participation from the School of Computing at NUS. The Corporate Lab brings together a multidisciplinary research ecosystem spanning AI algorithms, accelerator architectures, low-power memory systems, circuit design, silicon technologies, and application development. The programme will integrate NUS’ pioneering research with ST’s expertise in semiconductor technology, system development, and industry operations.

RELATED POSTS

KP Human Development Foundation’s ₹25-Crore CSR Initiative to Create Inclusive Home for 200 Persons with Disabilities

Bondada Engineering Secures Rs 410.1 Million Smart Metering Project from TGNPDCL

NUS President Professor Tan Eng Chye said: “The ST–NUS HELIX Corporate Lab is a testament to the value of industry–academia partnerships in translating research into innovation. By combining NUS’ research strengths with STMicroelectronics’ industrial capabilities, we are building not only advanced, cutting-edge edge AI hardware, but also the talent and ecosystem that will help define the future of Singapore’s semiconductor and AI industries.”

Laurent Malier, Executive Vice President, Global Technology R&D at STMicroelectronics, said: “ST’s strength as an integrated device manufacturer lies in our ability to bring together advanced silicon technologies, embedded memory, circuit design, heterogeneous integration and chiplets. Through HELIX, we are creating an industrially relevant foundation to explore differentiated AI computing technologies and accelerate the translation of promising research into scalable semiconductor solutions.”

The Corporate Lab was officially launched today by Ms Low Yen Ling, Senior Minister of State, Ministry of Culture, Community and Youth, and Ministry of Trade and Industry, as the Guest-of-Honour.

Building the future of edge AI

Edge AI processes data directly within or close to a device rather than relying exclusively on remote cloud infrastructure. This enables faster response times, stronger data privacy, improved energy efficiency, and greater resilience in environments with limited or intermittent connectivity. These capabilities are increasingly important for AI systems that must perceive, reason, and act in real time, in the real world – often described as Physical AI.

HELIX focuses on a key frontier within this space: embodied AI, where intelligence is built directly into a physical form — such as a robot, humanoid, or drone — combining multi-modal sensing, on-device computing, and real-time actuation. Delivering that intelligence efficiently, on compact and power-constrained hardware, is the challenge HELIX is built to address. Enabling these capabilities at the edge requires innovation across algorithms, software, system architecture, and hardware.

HELIX builds on ST’s long-standing journey in AI and will help explore new system-level solutions that combine efficient computing, advanced memory architecture, and application-driven design to address the requirements of future intelligent devices. Complementing ST’s capabilities, NUS brings world-class expertise in integrated circuits, computer architecture, AI models, and system design. Under the partnership, researchers from NUS and STMicroelectronics will jointly work on research work packages, talent development, IP creation, and demonstration activities.

The research at HELIX will span the full technology stack, from AI models and system architecture to heterogeneous accelerators, on-chip memory hierarchies, circuit design, chip integration, and silicon implementation. It will focus on memory-centric architecture, innovative in-memory computing, and scalable compute-and-memory systems, supported by ST’s P18 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology and embedded Phase Change Memory (PCM). P18 FD-SOI enables ultra-low-power operation and adaptive body-biasing, while embedded PCM provides dense, non-volatile storage on the same die alongside the on-chip SRAM hierarchy. Together, these capabilities can reduce the off-chip data movement that dominates the energy consumption of memory-bound AI workloads.

ST will make a substantial technology and engineering contribution to HELIX by providing NUS with a dedicated design chassis implemented in its proprietary P18 18nm FD-SOI technology. The platform will bring together ST’s silicon, architecture, integration, and engineering capabilities to give researchers an industrial-grade foundation for developing, integrating, and validating new AI accelerator concepts. By eliminating the need to build the underlying infrastructure from the ground up, the design chassis will enable greater focus on differentiated innovation, accelerate system-level validation, and create a more direct path from technology pathfinding to industrialization.

By combining advances across AI algorithms, accelerator architectures, memory systems, circuits, and semiconductor technologies, HELIX aims to address the energy-efficiency, memory-bandwidth, latency, scalability, and integration challenges associated with deploying increasingly capable AI systems at the edge.

Nurturing talent to drive Singapore’s semiconductor ecosystem

The establishment of HELIX represents a strategic investment in Singapore’s future competitiveness in edge AI and advanced semiconductor systems. By fostering industry-relevant R&D, HELIX will strengthen local capabilities and nurture a new generation of talent in AI systems and chip design.

Students, researchers, and professionals will have opportunities to participate in cutting-edge projects led by HELIX, gaining hands-on experience with the latest technologies, collaborating with industry leaders, and developing skills that meet the evolving needs of the sector. Through these initiatives, HELIX aims to build a robust talent pipeline and position Singapore as a global hub for innovation in edge AI and semiconductor technologies.

Tags: AIpowersemiconductorSTMicroelectronicsTechnology
ShareTweetShare
Palak

Palak

Related Posts

KP Green

KP Human Development Foundation’s ₹25-Crore CSR Initiative to Create Inclusive Home for 200 Persons with Disabilities

by Urja Daily
September 14, 2026
0

New Delhi - Construction of Prabhu Nu Ghar, the world's first dedicated old-age home for persons with disabilities, is now...

Bondada Engineering

Bondada Engineering Secures Rs 410.1 Million Smart Metering Project from TGNPDCL

by Urja Daily
September 14, 2026
0

Bondada Engineering Limited, through its joint venture with BEST Infra Private Limited, has received a letter of intent (LoI) from...

Ravindra Chauhan, Senior Management Officer – Business Development - POWERCON

POWERCON Group Deepens Leadership Bench with Ravindra Chauhan’s Appointment

by Urja Daily
September 12, 2026
0

Pune : POWERCON Group has appointed Ravindra Chauhan as Senior Management Officer – Business Development. The appointment reinforces POWERCON's commercial...

ESSCI

ESSCI Partners with Aditya Birla Group to Skill 40,000 Electricians Across India

by Urja Daily
September 12, 2026
0

New Delhi: The Electronics Sector Skills Council of India (ESSCI) has partnered with the Aditya Birla Group’s Wires and Cables business...

ETC 2026 Inauguration_Mr. Sriram Kumar, Mr. Bhawesh Kumar, Mr. Kiron D. Shah, Mr. Anand Anandkumar, Dr. Veerappan V. V., and Ms. Nandini B

ELCIA Tech Summit 2026 Positions Electronics City as a GCC Growth Hub

by Urja Daily
September 12, 2026
0

Bengaluru : From AI in manufacturing and human-AI collaboration to healthcare, startups, aerospace and defence, urban mobility, quantum computing and...

Next Post
Joint Solar

Joint Solar puts quality and reliability at the heart of India’s solar push towards 500 GW

RENEWABLES

Renewables Set to Surpass Gas as Capacity Grows by 83 GW

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

RECOMMENDED

KP Green

KP Human Development Foundation’s ₹25-Crore CSR Initiative to Create Inclusive Home for 200 Persons with Disabilities

September 14, 2026
Bondada Engineering

Bondada Engineering Secures Rs 410.1 Million Smart Metering Project from TGNPDCL

September 14, 2026

MOST VIEWED

  • Solar

    When the Sun Began Paying the Electricity Bills: The Story of PM Surya Ghar Muft Bijli Yojana

    0 shares
    Share 0 Tweet 0
  • India’s Emerging Polysilicon Manufacturing Ecosystem: Opportunities and Challenges

    0 shares
    Share 0 Tweet 0
  • KP Group’s Listed Renewable Businesses Post Strong Multi-Year Growth as Portfolio Expands Beyond 9.2 GW

    0 shares
    Share 0 Tweet 0
  • KP Group & PP Savani University Launches Urjanoor Scholarship

    0 shares
    Share 0 Tweet 0
  • StarlinePS Enterprises Invests ₹160 Crore in Celloraa Energy

    0 shares
    Share 0 Tweet 0

KP Human Development Foundation’s ₹25-Crore CSR Initiative to Create Inclusive Home for 200 Persons with Disabilities

Bondada Engineering Secures Rs 410.1 Million Smart Metering Project from TGNPDCL

Premier Energies and RCT India Partner to Develop 12 GWh BESS Facility in Telangana

POWERCON Group Deepens Leadership Bench with Ravindra Chauhan’s Appointment

GREW Solar Strengthens West India Presence with New Distribution Partnership with Indogreen Infra LLP

ESSCI Partners with Aditya Birla Group to Skill 40,000 Electricians Across India

Latest Magazine

© 2016 – 2025 TechZone Print Media | All Rights Reserved

  • About Us
  • Contact Us
No Result
View All Result
  • News
  • Renewable
    • Solar
    • Rooftop
    • Floating Solar
    • Module
    • Wind
    • Hydrogen
    • Biomass
    • Tenders
    • Sustainibility
  • Storage
  • E-Mobility
  • Battery
  • Smart City
  • Power
    • Smart Grid
    • Microgrid
    • Off-Grid
  • Editor’s Pick
    • Articles
    • In Talks
    • E-MAG
    • Market Research
  • On-demand Webinars
  • More
    • Events
    • Contact Us
    • Subscribe

© 2016 - 2025 TechZone Print Media | All Rights Reserved